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Thermal Paste - 1g, density: 3,7g/cm3, thermal conductivity of 12,5W/mK, electrically non-conductive
Thermal Paste - 2g, density: 3,76g/cm3, electrically non-conductive
Thermal Paste - 1g, density: 2,6g/cm3, thermal conductivity of 11,8W/mK, electrically non-conductive
Fitting Kit - contact sealing frame, to protect exposed Ryzen CPU components, prevents problems with system memory detection, material anodized aluminium, optional silicone foam insert, compatible with Ryzen 8X00G series APUs, screws and wrenches included
Thermal Paste - 5g, density: 6,24g/cm3, thermal conductivity of 73W/mK
Thermal Paste - 5,55g, density: 3,7g/cm3, thermal conductivity of 12,5W/mK, electrically non-conductive
Thermal Paste - 11,1g, density: 3,7g/cm3, thermal conductivity of 12,5W/mK, electrically non-conductive
Thermal Pad - thermal conductivity: 62,5 W/mK - size: 32 mm × 32 mm × 0,2 mm
Thermal Pad - thermal conductivity: 62,5 W/mK - size: 38 mm × 38 mm × 0,2 mm
Fitting Kit - improves cooling, for Intel motherboard with LGA1700 socket, reduces the processor temperature, anodised aluminium body, replaces the ILM on the motherboard, CPU Contact Frame for 13th and 14th generation, 4× UNC hemispherical head screws, 3/8" thread, Hexagon Allen wrench 5/64", Torx T20 angle wrench, dimensions 71 × 51 × 6 mm (W×H×D)
Thermal Paste - 1g, density: 6,29g/cm3
Thermal Paste - 3,9g, density: 2,6g/cm3, thermal conductivity of 11,8W/mK, electrically non-conductive
Thermal Paste - 37g, density: 3,7g/cm3, thermal conductivity of 12,5W/mK
Thermal Paste - 1g, density: 2,6g/cm3, thermal conductivity of 8,5W/mK, electrically non-conductive
Thermal Pad - thermal conductivity: 8 W/mK - size: 120 mm × 20 mm × 3 mm
